

Founded by EPFL mathematics professor Dr. Amin Shokrollahi, Kandou AI solves the most critical bottleneck in AI infrastructure: moving data between chips fast enough, efficiently enough, and affordably enough to keep pace with model growth.
Under CEO Srujan Linga, the company has moved from pioneering research into full-scale commercial deployment. Powered by proprietary Copper MIMO interconnect technology, Kandou AI develops high-speed, energy-efficient chip-to-chip connectivity solutions — from chiplet-based AI fabric to next-generation SerDes IP — enabling customers to build scalable AI systems at dramatically lower cost and power consumption.
From day one, we've had one obsession
To build the world's most advanced high-speed connectivity solutions. We believe that the next generation of AI won't be defined by compute alone, but by how efficiently data moves between processors, memory, and systems. AI could transform civilization the way electricity did. But only if it becomes dramatically more accessible. That's what we're solving for.
vor 4 Stunden
Internship Semiconductor Engineering - Kandou AI - Dortmund